Sample Halogen Free PWB Material
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Laminate Property
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HF Part #
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STD Part #
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Sample Prep
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Method
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Value
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Value
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IPC-TM-650
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Decomposition Temperature (Td)
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2.4.24.6
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TMA Tg
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2.4.24 or 25
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DMA Tg
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2.4.24 or 25
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DSC Tg
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2.4.24 or 25
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CTE x/y 50C-Tg (ppm)
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2.4.41
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CTE z 50C-Tg (ppm)
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2.4.24
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CTE z% 50-260C (ppm)
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1. Copper Peel Strength
> 17um Peel Ambient
> 17um Peel Thermal Stress
> 17um Peel @240C
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2.4.8
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2.4.8.2
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2.4.8.3
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2.
Volume Res. after moisture
Volume Res. at Elevated Temp
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2.5.17.1
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2.5.17.1
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3.
Surface Res. after Moisture
Surface Res. at Elevated Temp
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2.5.17.1
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2.5.17.1
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4.
Moisture Absorption
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2.6.2.1
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5.
Dielectric Breakdown
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2.5.6
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6. Permittivity @ 1 GHz
@ 5 GHz
@ 10 GHz
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2.5.5.1
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2.5.5.1
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2.5.5.5
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7. Loss Tangent @ 1 GHz
@ 5 GHz
@ 10 GHz
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2.5.5.1
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2.5.5.1
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2.5.5.5
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8. Dk/Df Graphs?: Dk/Df vs Temp? Dk/Df vs Humidity?
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9. Ambient
Min. Flex Length Direction
Min. Flex Cross Direction
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2.4.4
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10. Elevated Temp
Min. Flex Length Direction
Min. Flex Cross Direction
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2.4.4.1
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11.
Arc Resistance minimum
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2.5.1
|
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12.
Thermal 10 sec @288C min.
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2.4.13.1
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13.
Electrical Strength
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2.5.6.2
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14.
Time to Delamination Clad
T260
T288
T300
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2.4.24.1
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2.4.24.1
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2.4.24.1
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15.
Flammability
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UL-94
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16.
UL Certification
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Link to Supplier’s UL File
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17.
Thermal Conductivity
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