SAC Microvoids
Publication Date:
2008
Number of Pages:
34
Contributors:
Sun Microsystems, Alcatel-Lucent, Purdue, Alcatel-Lucent, NSC, Delphi, MacDermid Objectives
Measure the effects of bath parameters and other treatments upon the intermetallic compound layer and the root cause of brittle fractures in SAC Alloys-Microvoids
Support Electronic Industry efforts to improve the Reliability of SAC Alloys
Obtain quantitative results that will provide corrective action guidance to industry to mitigate the occurrence of brittle failures in drop or shock; for example cell phones
Develop fracture mechanics models that account for the effect of microvoids and intermetallic compounds material properties in simulated loads
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