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Publications

All reports are available to HDP User Group Member Companies free.  Some reports are made available to the public for a fee.  For more information on a specific report click the report title.

 

Report / Publication Title

Publication Year
Design for the Environment
Evaluation of Environmentally Sensitive Material Content in IT Products 2003
Definition of Lead / Halide-Free Products 2001
Halogen-Free
HDP Halogen Free Guideline 2008
Environmental Assessment of Halogen-Free Printed Circuit Boards 2004
Transition to Halogen-Free Electronics 2002
Lead Free
Lead Free Assembly Guideline 3.0 (NEW!) 2010
General Purpose Lead Free (GPLF) Process Optimization Study 2009

Lead Free Acceleration Factors (Members Only)

 2008

Lead Free Prined Wiring Board Material Reliability (Members Only)

 2008

SAC Microvoids (Members Only)

 2008
Accelerated Reliability Testing and Analysis of Lead Free Solder Interconnects (APEX) 2006
Optimization of Lead Free SMT Reflow & Rework Process Window (APEX) 2006
Via (Plated Through Hole) Integrity with Lead Free Soldering (APEX) 2006
Evaluation of the Solderability of an Alternate Alloy 2004
Low Temperature Lead Free Reliability Characterization 2003
Lead Finish
Component Terminal Finishes 2007
Technical Description of Nickel-Palladium Based Component Terminal Finishes 2005
Opto Electronics
Materials and Reliability of Optical Packages 2003
Power Supply
Board Mount Power Supply (BMPS) Application Guideline, version 2.0 (NEW!) 2010
Board Mount Power Supply (BMPS) Application Guideline, version 1.0 2007
Special Documents
Juniper Paper on System Reliability Requirements 2008