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Polymer Ball Interconnect

Idea/Definition Information
Summary: 

Polymer balls to replace solder balls in BGAs and CSPs have been tried for many years with very different results depending on application and soldering process. This project will look into ball manufacturers, multiple polymer compositions, coatings and soldering methods. Reliability in drop test and thermal cycling for different size components and different amount of solder will be assessed. Member companies representing different levels in the supply chain will together work out optimal solutions for telecom, mobile, medical and other applications.

If you are interested in this project and would like to subscribe to the project mailing list, please click here (members only) or email the project facilitator, Brian Smith - brians@hdpug.org.
 

Background: 

Polymer Ball Interconnect technology is a recent development designed as replacement to traditional solder balls in ball grid array and chip scale component packaging. The technology offers the potential for improved package to PCB joint reliability, particularly in hand held and portable applications where mechanical shock test resistance is a critical design criterion.

The technology consists of an accurately produced, polymer based, spherical core which is metalized with a solderable external finish. The balls are attached to both component package and PCB using conventional mass soldering techniques.

The technology is still in its infancy but several packaging companies are showing interest.This project has the objective of assessing the feasibility of polymer ball interconnect by exploring demand and specific business/technical requirements as well as conducting preliminary practical reliability assessments of the technology.

Conpart joined HDPUG in beginning of 2009 and is a specialist in producing mono-sized polymer balls, 5...500 um.

Problem: 

In order for the polymer ball interconnect to become universally accepted in the component packaging industry the technology must be demonstrated to meet mechanical and electrical requirements as well as satisfying commercial expectations. As these requirements are not currently clearly defined the project will be structured to identify industry needs. A demonstrator will then be developed and tested to evaluate the capabilities of polymer ball interconnect to meet these requirements.

Approach: 

The project will leverage the expertise of the HDPUG member companies to identify the key criteria that the polymer ball interconnect technology should be assessed against. A working team has been  formed with inputs and support from team members representing a broad spectrum of the electronics manufacturing supply chain, including materials and component suppliers, PCB fabricators and assemblers and OEMs / systems integrators.

Several test vehicles have been designed to enable a direct reliability performance comparison between SAC solder balls and polymer cored balls for a range of components. Accelerated thermal cycling, drop testing and monotonic bend testing will be used to evaluate component to board interconnect integrity.