Via (Plated through Hole) Integrity with Lead-Free Soldering (APEX)
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$25.00
List Price: $50.00
Publication Date:
2006
Number of Pages:
16
Contributors:
Celestica; Endicott Interconnect Technologies; IBM, HDP User Group International, Inc.; Siemens SKU: HDP 200603A
Description
Abstract
The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle). Seventeen different Pb-free SMT components were evaluated, including PBGAs, CBGAs, CCGAs, power modules, QFPs, PLCCs, CSPs, chip capacitors and resistors. All were attached to a six layer PCB using SAC387 solder paste according to the HDPug GPLF defined assembly process. This study specifically compares the reliability behavior of these various component types when subjected to expected Pb-free assembly process extremes such as minimum peak reflow temperature and extended reflow soak times. Microstructural features of as-assembled SAC solder connections are first explored. Failure data is reported for the various component types and assembly conditions.
All SAC solder thermal cycling data was collected along with eutectic SnPb solder controls.
This report was presented at APEX 2006.
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$25.00
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