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Multiple Alloy Screening

Idea/Definition Information
Actual Project Stage: 
Implementation
Project Category: 
Lead-Free
Project Leader Company: 
Alcatel/Lucent
Background: 
  • BGA suppliers have introduced a significant number of new Pb-free BGA solder ball alloys.
  • Most have been introduced to address drop/shock performance issues.
  • Very little/almost zero data is available on the thermal cycle performance of these alloys - which is key to many of the high reliability community not building hand-held consumer products.
    • The limited data available suggests that thermal cycle performance may be significantly different between the various alloys.
    • Many of these same components end up in high-reliability products.
Problem: 

It is very difficult to make intelligent decisions on the viability of components using any of these alloys without data.  This screening experiment is intended to generate some of the needed data.

Approach: 

Perform a limited sample-size thermal cycle (0-100C, 30 minute dwell) screening experiment to compare various BGA Lead-free solder ball alloys.

HDP User Group Project Facilitator: 
Laurence Schultz
Key Participants: 

Alcatel/Lucent, Freescale, Premier Semiconductor, Sun, Cisco, Juniper, Celestica, Flextronics, IBM, Tekelec, Agilent, Dell, Fujitsu, HP, ITRI, Motorola, TI