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Mechanical Fatigue Test for Solder Joint Reliability

Idea/Definition Information
Background: 
Shortening of the product development cycle requires a new method that can evaluate the reliability of solder joint in the short time instead of the conventional thermal cycle test.
There are several proposals on the solder joint reliability test using the mechanical fatigue test from universities and an institute. Mechanical shear fatigue test have been proposed to IEC standards.
Problem: 
There is few data for correlation on mechanical fatigue test and thermal cycle test. So the project will study on practicality and its issues of mechanical fatigue test as a solder joint reliability test.
  • Data collection on mechanical fatigue test
  • Correlation of the reliability data between mechanical fatigue test and thermal cycling test
  • Finding the package and solder joint conditions where mechanical fatigue test can be used as the reliability test
Approach: 

Deliverable:
  • Correlation the reliability data between mechanical fatigue test and thermal cycle test
  • Finding the package and solder joint conditions where mechanical fatigue test can be used as the reliability test
  • Share raw data and detailed information within HDP User Group

sites/all/files/privatedownloads/Project_Pages/MechFatigue/HDP_Mech_Fatigue_paper_809.pdf