This is the final presentation for the HDP User Group Project to evaluate the reliability of a bismuth/tin/silver low temperature lead free solder.
The purpose of the effort was to evaluate the reliability of a low temperature (170-180 °C) lead free soldering process as an alternative to the more common high temperature (250–260 ºC) process.
Sample assembled boards were built and tested in air to air temperature cycle. The experimental plan, test vehicle design, assembly parameters, all test results and failure analysis are presented.
HP
