Low Temperature Lead-Free Reliability Characterization
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$25.00
List Price: $50.00
Publication Date:
2003
Number of Pages:
8
Contributors:
Alcatel; Amkor; ChpPac; Flextronics; HDP User Group International, Inc.; Intel; ST Micro; Texas Instruments SKU: HDP 200302R
Description
Abstract
The objective of this collaborative HDPUG member project is to evaluate the interconnect reliability of Pb-free components assembled with a low temperature (170 - 180 C.) lead-free soldering process as an alternative to the mainline industry process (250 - 260 C. ).
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$25.00
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