Low Temperature Lead-Free Reliability Characterization
Purchase Online:
$25.00
List Price: $50.00
Publication Date:
2003
Number of Pages:
32
Contributors:
Alcatel; Amkor; ChpPac; Flextronics; HDP User Group International, Inc.; Intel; ST Micro; Texas Instruments SKU: HDP 200302R
Description
Abstract
The objective of this collaborative HDPUG member project is to evaluate the interconnect reliability of Pb-free components assembled with a low temperature (170 - 180 C.) lead-free soldering process as an alternative to the mainline industry process (250 - 260 C. ). The download includes all documentation from the project, including data files, reports, and presentations.
Online Price:
$25.00
For a hard copy or CD, contact the HDP Office +1 480-951-1963 or email