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Integrated Circuit Attachment to Printed Electronic Substrates

Idea/Definition Information
Summary: 

Notice

This project has currently been put on hold as we have been unable to identify and gain committment from companies from certain key areas of the supply chain to be able to implement the specific activities needed to complete the project.

HDP User Group recognises that printed electronics is a maturing technology and acknowledges the interest registered in the project by several of our members. Ideas and  other projects in this field are encouraged and members having any proposals are requested to contact HDPUG Project Facilitator, Brian Smith (brians@hdpug.com) to discuss them.

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Printed electronics (PE) is a rapidly emerging technology that allows conductors and certain electronic devices to be produced on flexible substrates using conventional ink printing techniques.   This project conducts a study of the options for high speed attachment of both naked and packaged ICs to PE substrates and will conduct practical evaluations of potential solutions.

  

Background: 

Printed electronics is a rapidly emerging interconnect technology which utilizes conventional high volume paper printing techniques to define interconnect and passive devices on electronic flexible substrates. The technology (typically using reel to reel manufacturing processes) offers extensive cost reduction opportunities compared with standard PWB fabrication processes and opens up new markets in very low cost disposable electronics. The technology is already being adopted in interactive display applications and has created major interest in consumable intelligent packaging where it can be used for displaying product history (particularly for perishable goods), tamper indicators and counterfeit detection. The technology is still in its infancy but already analysts are predicting that it could be worth 30 billion USD by 2015.

Problem: 

To date printed electronic applications have focused on fairly low complexity, passive applications. However demand is increasing for greater functionality some of which can only be met by incorporating integrated circuit microcontroller technology into the design. It is imperative that assembly costs for the IC attachment are consistent with the low cost demands for the application areas in which printed electronic technology is likely to be deployed. Add to that that the typical substrate materials used are incompatible with conventional soldering processes due to maximum temperature limitations and it is clear that new very high volume IC mounting techniques are needed.  

This project will undertake an evaluation of available options for IC attachment to printed electronic substrates and will assess the commercial and technical implications of various potential solutions.

Approach: 

The project will engage a multi-company working group from across a broad cross section of the electronics manufacturing supply chain to achieve the following objectives:

  • Review current/future options for high speed IC mounting to printed electronic substrates.
  • Identify potential commercially competitive total solutions including equipment, materials and processes.
  • Conduct evaluation (performance assessment) of possible solutions
  • Create a guideline for future applications

Further information and a detailed project proposal can be downloaded at the following link - IC Attachment to Printed Electronic Substrates Project Proposal