HDP HF Material Example 2
HDP HF Material Example 2
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Material Property
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Units
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IPC-TM-650 Section
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Decomposition Temperature (Td) = 450
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°C
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2.4.24.6
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Glass Transition Temp (Tg) = 185
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°C
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2.4.24.6 DSC
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CTE x/y 50C-Tg = 12
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20% glass/resin
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ppm
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2.4.24.6
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CTE z 50C-Tg = 40
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20% glass/resin
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ppm
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2.4.41
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CTEz% 50-260C = 2.6
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20% glass/resin
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ppm
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2.4.24
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> 17um Peel Ambient = 7
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Lb/In
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2.4.8
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> 17um Peel Thermal Stress = 8
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Lb/In
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2.4.8.2
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> 17um Peel @250C = 6
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Lb/In
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2.4.8.3
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Volume Res. at Elevated Temp = 2.8 X 106
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MΩ-cm
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2.5.17.1
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Surface Res. at Elevated Temp =1 X 107
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MΩ
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2.5.17.1
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Dielectric Breakdown = 60
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KV
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2.5.6
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Permittivity @ 1GHz = 4.30
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-
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2.5.5.1
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Permittivity @ 10GHz = 3.5
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-
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2.5.5.1
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Permittivity @ 100GHz = 3.0
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-
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2.5.5.5
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Loss Tangent @ 1GHz = .0190
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-
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2.5.5.1
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Loss Tangent @ 10GHz = .0160
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-
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2.5.5.1
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Loss Tangent @ 100GHz = NA
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-
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2.5.5.5
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Ambient temp Min. Flex Length Direction = NA
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Mpa
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2.4.4
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Ambient temp Min. Flex Cross Direction = NA
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Mpa
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2.4.4
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Elevated Temp Min. Flex Length Direction = NA
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Mpa
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2.4.4.1
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Elevated Temp Min. Flex cross Direction = NA
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Mpa
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2.4.4.1
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Arc Resistance > 115
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Seconds
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2.5.1
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Electrical Strength = 36
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KV/mm
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2.5.6.2
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Time to Delamination Clad T260 = 60
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Seconds
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2.4.24.1
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Time to Delamination Clad T288 = 40
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Seconds
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2.4.24.1
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Time to Delamination Clad T300 = 30
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Seconds
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2.4.24.1
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Flammability = V1
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Rating
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UL-94
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HDP HF Material Example 2 Product Bulletin Link