Nevertheless, most end users of electronic components (system integrators and EMS providers) still have concerns about long term Sn-whisker growth risk with Sn based termination finishes. NiPd-based pre-plated lead frame (PPF) finishes have been introduced as one Pb-free alternative with no Sn-whisker risk.
Scope of Phase 3
- Provide MSL, Moisture Sensitivity Level, information of Pb-free solutions because the market needs of high reliability applications such as server, automotive, communication, etc. is increased very much.
- Evaluate MSL performance of Pb-free surface finishes, Matte tin, NiPdAu, NiPdAu-alloy, etc. to give better surface finish choices to the package user group.
Preparation for Phase 3
- Samsung, Amkor and TI agreed on scope
- Define deliverables
- Design experiment
- Enlist/define A/T sites
- Assemble BOM - supplier support
- Enlist MSL test sites
- Refine time line
Factors to Consider - BOM A/T
- Leadframe
- Package thickness, die pad size, down set depth, exposed pad
- QFP, QFN, SOIC, and/or TSOP
- At least one with exposed pad
- Leadframe Finish
- Ag spot, u-PPF, upgrade u-PPF, NiPdAu, rough surface treatment
- Mold compound, Die attach - focus on common BOM and minimize test legs
- Die - dummy or functional
