Component Terminal Finishes
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$25.00
List Price: $50.00
Publication Date:
2007
Number of Pages:
37
Contributors:
Samsung, TI, Alcatel, Sun, NSC, Siemens SKU: HDP 200701R
Improving the Moisture Sensitivity Level of Plastic Encapsulated Components with Ni/Pd Lead Finish
Description
Abstract
Various techniques have been proposed to reduce the Sn-whisker risk with matte Sn finishes. Nevertheless, most end users of electronic still have concerns about long term Sn-whisker growth risk with Sn based terminal finishes. NiPd-based Pre-Plated lead Leadframe (PPF) finishes have been introduced as one Pb-free alternative with no Sn-whisker risk. An improved technology that overcomes the technical limitations of the existing NiPd-based finishes has been developed and applied extensively, but degradation in the Moisture Sensitivity Level (MSL) of a package component due to the limited adhesion quality between compound and noble metal surface and the increase in Pb-free SMT temperature (260℃) has occurred more frequently with NiPd-based finish packages.
Recently, surface roughening technology have been proposed on Pd-PPF to enhance MSL performance, but those technologies were not practical solution because it makes secondary quality problem like excessive resin bleeding, unstable wire bonding, poor solderability and inconsistency in MRT.
The previous studies for the improvement of MSL for a leadframe were focused on the development of mold compounds and die attach glue. In particular various surface treatment technologies have been attempted for a normal Cu leadframe so far, However, most of these processes have not been accepted as a standard production process yet, due to the factors such as increased manufacturing costs, reduced assembly quality from surface roughening, limited process capability of surface etching, lack of quality repeatability and limited MSL-1 implementation.
NiPd-based PPF with high-level MSL that accommodates all demands in market has been successfully developed. Through these new technologies, NiPd-based PPF in various EMC and epoxy combinations can now attain better MSL performance than Cu Leadframe.
Evaluate the MSL performance of surface finishes, Normal Cu surface, Ni/Pd/Au, Ni/Pd/Au-alloy, etc. Development results on roughen surface NiPd-based finishes that are less sensitive to the type of die attach glue, EMC, and package design.
The major factor for robust MSL-1 performance is investigated by Scanning Acoustic Microscope (C-SAM), Auger electron spectroscope (AES), and Scanning Electron Microscope (SEM).
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$25.00
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