3D Packaging SiP

Idea/Definition Information
Actual Project Stage: 
Idea and Definition
Project Category: 
Semiconductor Packaging
Project Leader Company: 
Meadville Group
Background: 

System in Package is a cost efficient and fast solution to ultimate miniaturization and simultaneously improving electrical performance.

In this project we will look into SiP integration based on 3D solutions.

We will look into availability of new technologies and assessing them in theory and practice.

Problem: 

In order to multiply packaging density and improve high speed performance a large number of 3D integration of System in Package solutions are available on the market. Few of us have, however, hands on experience and those having have typiucally experience only of few technologies and manufacturers. Passives are essential in miniaturization and we will look also on how to integrate these.

Approach: 

The first round in 2008/2009 did not succeed in producing a practical demonstration. So we decided to step back and start again, this time performing a larger investigation of what is of interest to Members and what can be available.

Results from 2008 & 2009

A physical project meeting was held on February 24 2009 and conference calls were held March 17 & 19. Following are related documents.

Presentation at Member meeting February 25.

Minutes from project meetings in Santa Clara.

Project presentation December 2008.

Here are the minutes from a conference call on May 12 2009.

Technology Questionnaire

In December 2009 we produced a description of the new approach in the Project and sent out a Questionnaire to both Members and some key players outside the current membership.

We got 12 replies providing a very good overview of the interest among members and few potential members. The results were presented at the February 2010 Member Meetings in Santa Clara, see file.

Based on the discussions there a project plan consisting of 4 alternative or parallel subprojects was worked out and sent to potential participants April 1st 2010. This file is now out for feedback within April, see voting table.

A workshop on these project proposals is planned for May 18 in Bruchsal, Germany.

HDP User Group Project Facilitator: 
Paul Collander
Key Participants: