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3D Packaging SiP

Idea/Definition Information
Summary: 

System in Package (SiP) is a cost efficient and fast solution to ultimate miniaturization and simultaneously improving electrical properties.  This project will look into SiP integration based on 3D solutions. Latest techniques will be evaluated for embedding devices and creating multi-level constructions. Test vehicles will be produced and characterized to assess both electrical performance improvement and long term reliability.

If you are interested in this project and would like to subscribe to the project mailing list, please click here (members only) or email the project facilitator, Brian Smith - brians@hdpug.org.
 

Background: 

System in Package is a cost efficient and fast solution to ultimate miniaturization and simultaneously improving electrical performance.

In this project we will look into SiP integration based on 3D solutions.

Latest generation 3D SiP technologies will be identified and features evaluated for both electrical and physical performance.

Problem: 

In order to multiply packaging density and improve high speed performance a large number of 3D integration of System in Package solutions are available on the market. However, few of the HDPUG members have hands on experience and those who have are typically limited to only afew technologies and manufacturers. The project is designed to address this experience gap and to provide an opportunity for HDPUG members to work collaboratively in evaluating the benefits of integrating active and pasive components into 3D structures.

The project will apply a hands on approach to conducting assessments of  the technology with test vehicles being designed, fabricated and submitted to extensive testing techniques to measure performance.

Approach: 

Project planning in 2010

The definition stage of the project focussed on designing the test vehicles and agreeing the test plan. A questionnaire was circulated to project members at the beginning of the year.

The results from that questionnaire was presented at Member Meetings in February 2010 after discussions at a separate WORKSHOP held in Santa Clara.

A series of workshops have been held throughout 2010 to determine the optimum approach to taking the project forward.

3D SiP Workshop at Member Meetings in Bruchsal May 2010  - WORKSHOP

3D SiP Workshop at ASE, Kaohsiung, TW October 25 2010

 

TV2 Design Concept

 

Technology Questionnaire

In December 2009 we produced a description of the new approach in the Project and sent out a Questionnaire to both Members and some key players outside the current membership.

We got 12 replies providing a very good overview of the interest among members and few potential members. The results were presented at the February 2010 Member Meetings in Santa Clara, see file.