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Accelerated Reliability Testing and Analysis of Lead-Free Solder Interconnects (2006) for $250.00 (USD) Add
Description: The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle).
Evaluation of the Solderability of an Alternate Alloy Project (English Version) (2004) for $250.00 (USD) Add
Description: Member Downloads This project is a part of General Purpose Lead Free assembly system, which has been planned to define a guideline compatible with tin-lead based soldering.
Evaluation of the Solderability of an Alternate Alloy Project (Japanese Version) (2004) for $250.00 (USD) Add
Description: This project is a part of General Purpose Lead Free assembly system, which has been planned to define a guideline compatible with tin-lead based soldering.
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