 | Description:
The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle). |
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| Description: This paper describes the investigation and the results of that investigation for developing a consensus across the electronics industry on the definition of the Lead (Pb) free and Halide free electrical and electronic components. |
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| Description:
As a result of several independent industry technology development activities, multiple solder systems have been proposed and are in use in the industry. Many system integrators have developed company specific requirements. |
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| Description: As a result of several independent industry technology development activities, multiple solder systems have been proposed and are in use in the industry. Many system integrators have developed company specific requirements. |
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| Description:
This is the final presentation for the HDP User Group Project to evaluate the reliability of a bismuth/tin/silver low temperature lead free solder. |
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| Description:
Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of electronic components. |
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| Description: Matte tin (Sn) is being favorably viewed as a lead (Pb)-free finish for integrated circuit (IC) component terminations, despite the risk of Sn-whiskers. |
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| Description:
Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to support lead-free assembly. |
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