Matte tin (Sn) is being favorably viewed as a lead (Pb)-free finish for integrated circuit (IC) component terminations, despite the risk of Sn-whiskers. The electronics industry has chosen matte Sn plating because of the simple transition from SnPb post-mold plating and the assumed low cost of Sn finishes. Various mitigation / amelioration techniques have been proposed to reduce the Sn-whisker risk with matte Sn finishes. Nevertheless, most end users of electronic components (system integrators and EMS providers) still have concerns about long term Sn-whisker growth risk with Sn based termination finishes. NiPd based Pre-Plated lead Frame (PPF) finishes have been introduced as one Pb-free alternative with no Sn-whisker risk.

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