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Accelerated Reliability Testing and Analysis of Lead-Free Solder Interconnects (2006) for $250.00 (USD) Add
Description: The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle).
BMPS (Board Mount Power Supply) Guideline, Ver 1.0, (2007) for $2,500.00 (USD) Add
Description: The BMPS Guideline (2007) System Integrators and Power Module Suppliers need a common communication vehicle The ”BMPS Guideline” is suggested to serve as a common database The guideline is on the ”base technology level...
Definition of Lead/Halide-free Products (2000) for $150.00 (USD) Add
Description: This paper describes the investigation and the results of that investigation for developing a consensus across the electronics industry on the definition of the Lead (Pb) free and Halide free electrical and electronic components.
Environmental Assessment of Halogen-free Printed Circuit Boards (2004) for $150.00 (USD) Add
Description: The HDP User Group Design for Environment (DfE) group was formed in 2002 and was represented by companies such as Dell, Ericsson, HP, IBM, Intel and Nokia.
Evaluation of Environmentally-Sensitive Material Content in IT Products (2003) for $150.00 (USD) Add
Description: Over the past several years, increased attention has been placed upon the potential environmental impacts of IT products.
Evaluation of the Solderability of an Alternate Alloy Project (English Version) (2004) for $250.00 (USD) Add
Description: Member Downloads This project is a part of General Purpose Lead Free assembly system, which has been planned to define a guideline compatible with tin-lead based soldering.
Evaluation of the Solderability of an Alternate Alloy Project (Japanese Version) (2004) for $250.00 (USD) Add
Description: This project is a part of General Purpose Lead Free assembly system, which has been planned to define a guideline compatible with tin-lead based soldering.
GPLF Implementation Guideline, Ver 2.0, (2005) for $500.00 (USD) Add
Description: As a result of several independent industry technology development activities, multiple solder systems have been proposed and are in use in the industry. Many system integrators have developed company specific requirements.
GPLF Implementation Guideline, Ver 2.0, (2005) (Japanese Version) for $500.00 (USD) Add
Description: As a result of several independent industry technology development activities, multiple solder systems have been proposed and are in use in the industry. Many system integrators have developed company specific requirements.
Low Temperature Pb-free Solder Reliability Characterization (2003) for $150.00 (USD) Add
Description: This is the final presentation for the HDP User Group Project to evaluate the reliability of a bismuth/tin/silver low temperature lead free solder.
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