Member Meeting Objectives:

1. Communicate HDP plans and project status to members
2. Identify and assess member interest in potential new project areas 
3. Improve communication within the membership regarding current and future technical issues and solutions

Hotel Information –

Angelo Hotel
CZ-150 00 Prague 5,
Radlicka 1g
Czech Republic

Tel.: +420 234 80 1111
Fax: +420 234 80 9999
Email: info@angelohotel.com

April 25th, Agenda HDP User Group Public Project Presentation Meeting
	Project Formation/Implementation Process	Marshall Andrews, HDP User Group
	HDP User Group Implementation Projects Overview	Marshall Andrews, HDP User Group
	HDP User Group Definition Projects BMPS Module to PWB Interconnections Lead-free Copper Erosion Halogen-free Product Properties Halogen-free Product Database
	HDP User Group Idea Projects Characterization of New High Speed PCB Materials Collection of property of SAC alloy under high strain rate for drop test modeling. Electromigration resistance of SAC alloy vs. Cu bump. Reliability Evaluation using Mechanical Fatigue Test
	Additional Presentations from meeting C4NP - Technology for lead-free wafer bumping C4NP - Manufacturing & Reliability Data for Lead Free Flip Chip Solder Bumping based on IBM’s C4NP process Reliability of Halogen-free Flip Chip Package and PCBA Advanced SiP Packaging and 3D interconnect in ITRI Electronics and Optoelectronics Research Laboratories (EOL) Industrial Technology Research Institute
April 26th, Agenda HDP User Group Project Status Meeting Member Meeting Members Only
	Highlights of BOD Meeting	Michael Kluwin, Juniper Networks
	The Communication Guideline (PDF 50KB)	Ruben Bergman, HDP User Group
	GPLF Reliability Characterization (PDF 2,762KB)	Brian Smith, Celestica
	Component Terminal Finishes Phase 2 (PDF 2,690KB)	Spancer Park, Samsung
	Pb-Free Acceleration Factors: Status Report, (PDF 1,361KB) Regression Analysis, (PDF 169KB) Failure Analysis, (PDF 1,401KB) Metallurgical Analysis 120 min dwell (PDF 4,836KB) RCT Testing and FE Modeling, (PDF KB)	Dave Love, Sun Thilo Sack, Celestica and Ganesh Subbarayan, Purdue
	SAC Microvoids (PDF 118KB)	Dave Love, Sun
	Mild Acceleration Factors (PDF 232KB)	Joe Smetana, Alcatel-Lucent
	Lead-free Board Materials Reliability (PDF 110KB)	Joe Smetana, Alcatel-Lucent
	New Business	All
	Member Feedback on Meeting	All