HDP User Group project Papers and Reports are available in PDF format to members at no charge when projects are completed. If you are an employee of a Member Company (See Membership List) register above for access to the member pages.

 Members, go to the Member's Download Section.

After a period of time determined by the Board of Directors, the PDF papers and reports are made available to the public for a fee. Some reports are available for no charge.

If you want to purchase a Reports and Paper by company Purchase order, contact Darryl Reiner.

The following reports are now available:

1. GPLF Implementation Guideline, Ver 2.0,
July 2005 (PDF 383KB) - More Information

	Cost	Download
Non-Members:	$500.00 (USD)

 2.  BMPS (Board Mount Power Supply) Guideline, Ver 1.0, 
April 2007 (PDF 2,652KB) - More Information
NOTE: Members of EPSMA or PSMA are offered the BMPS Guideline at a significant discount. Contact Daryl Reiner for more information.

	Cost	Download
Non-Members:	$2,500.00 (USD)
EPSMA/PSMA Members: Click Here	Discount	Contact Daryl Reiner to arrange the discount price

 

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The following reports are in our archives, but not currently available for sale: 

• Lead-Free Solder
  • Lead-Free Reports
  • Lead-Free Reliability Characterization Reports
• Halogen-Free Reports
• Environmental Reports
• Optical Reports

 

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Lead-Free Reports

• Technical Description of Nickel-Palladium based Component Terminal Finishes, April 2005
  More Information
• Optimization of Lead-Free SMT Reflow & Rework Process Window, February 2006

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Lead-Free Reliability Characterization Reports

• Evaluation of the Solderability of an Alternate Alloy Project (May 2005)
  • Evaluation of the Solderability of an Alternate Alloy Project Final Report - Japanese Version (PDF 516KB)
  • Evaluation of the Solderability of an Alternate Alloy Project Final Report - English Version (PDF 513KB) Revised 12 May 2005
    More Information
• Accelerated Reliability Testing and Analysis of of Lead-free Solder Interconnects (APEX), February 2006
• Via (Plated through Hole) Integrity with Lead-Free Soldering (APEX), February 2006
• Low Temperature Lead-Free Reliability Characterization, December 2002
• Pb-free Acceleration Factors
• Pb-free Power Cycle/Temp Cycle Correlation

 

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Environmental Reports

• "Evaluation of Environmentally-Sensitive Material Content in IT Products",  April 2003 (DFE-1)
  More Information
• "Environmental Assessment of Halogen-free Printed Circuit Boards", February 2004 (DFE-2 )
  More Information 

 

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Halogen-Free Reports

• Definition of Lead/Halide-Free Products - Final Report, February 2001
  More Information
• Transition to Halogen-Free Electronics Project - Final Report, October 2002
  More Information

 

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Optical Reports

• "Materials and Reliability of Optical Packages" (Optical Project, Phase 1) 2003
  More Information
• "Dimensional Stability of Optical Packages", Optical Project, Phase 2
  

 

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