Member News
Member News
Implementation Stage
After the project transitions into the Implementation Stage, access to information on the project progress is available only to members by password. If you work for a member company and do not have a password, Register below and you will receive an email authorizing access to the Member pages.
Projects in the Implementation Stage are managed by project leaders who organize the team from member companies working on the project, acquire resources, and make reports to the board and the membership. The work of the projects is accomplished by the volunteer project team members assisted by the HDP User Group Facilitator.
If necessary to move the project along and the budget allows, services not available within the Member companies may be purchased with HDP User Group funds. Projects are open to all member companies, and any member can have several representatives.
Following is a description of the current Implementation Stage Projects. For more information on joining the project, contact the HDP User Group Facilitator who’s name follows the project name.
Members may obtain detailed project information on each project by clicking on the project name in the left hand menu.
BMPS (Board Mount Power Supply) Guideline
HDP User Group Facilitator - Ruben Bergman, ruben.bergman@hdpug.se
Background: System integrators want to have well defined lead-free requirements on Board Mounted Power Supplies (BMPS), Pin compatibility between functionally compliant BMPS, and industry standards for function compatibility of BMPS. They also want to eliminate the need for modules to be attached using "press fit technology" or manual soldering.
Problem: Systems Integrators and Power Module Suppliers need a common communication vehicle that will define options for pin and function compatibility, reliable interconnection techniques, and "best practices" for design, manufacturing, and assembly of BMPS.
Approach: The project team will prepare and edit a "BMPS Guideline" document, based on the HDP User Group "General Purpose Lead Free (GPLF) Guideline. The Guideline is at the base technology level and the output will be provided to industry groups such as PSMA and EPSMA to encourage them to address needed industry standards. The "BMPS Guideline concept" is described in document: BMPS05001 BMPS Application Guideline Draft 4_Draft 4.pdf.
Component Terminal Finishes Phase 2
HDP User Group Facilitatior - Ruben Bergman, ruben.bergman@hdpug.se
Background: This project measures MSL results by surface treatment type and development results of new NiPd-based finishes for enhanced MSL, based on the results presented in Phase-1. Data includes the use of surface treatments and finishes such as Cu surface Zn-Cr Coating (A2 coating), Micro Etching , Brown Oxidation Treatment and Surface Adhesion Promoter Coating.
Problem: While an improved technology that overcomes the technical and cost issues of convention NiPd-based finishes have been developed and applied extensively, degradation in the Moisture Sensitive Level (MSL) of a package component due to the increase in Pb-free SMT temperature (260'C) has occurred more frequently with NiPd-based finish packages. As a result, component users have been hesitant to apply NiPd-based finishes. Various mitigation/amelioration techniques have been proposed to reduce the Sn-whisker risk with matte Sn finishes.
Approach: Nevertheless, most end users of electronic components (system integrators and EMS providers) still have concerns about long term Sn-whisker growth risk with Sn based termination finishes. NiPd-based Pre-Plated lead Frame (PPF) finishes have been introduced as one Pb-free alternative with no Sn-whisker risk.
Lead-free Acceleration Factors
HDP User Group Facilitatior - Jack Fisher, fish5er@mindspring.com
Background: Numerous papers (Sahasrabudhe, Clech, Lau, others) indicate that ATC test conditions have an different effect on the results of SAC solder fatigue life than they do on SnPb solder fatigue life.
Problem: Acceleration factors for SAC and Sn/Pb vary, depending on ATC test conditions, including dwell time and strain. The lower creep rate of SAC (compared to Sn/Pb) may lead to over-prediction of field life in ATC testing. ATC is an imperfect predictor of field life.
Approach: A test assembly will be designed that includes a variety of different component sizes and types. The test device will be assembled using two different types of lead free solder, and processed through a standard lead free assembly manufacturing line using typical process conditions. ATC testing will be conducted according to an experimental design which varies dwell times and conditions. Additionally, RTC Power Cycling will be conducted and results compared to ATC.
Lead-Free Board Materials Reliability
HDP User Group Facilitator - Jack Fisher, fish5er@mindspring.com
Identify and characterize the assembly compatibility and reliability of a significant number of “lower” cost PWB materials subjected to multiple Pb-free assembly reflow cycles (6X @ 260˚C) with sufficient data to understand the reliability implications to member company use environments.
For more information go to the Lead Free Board Materials Reliability Project page.
Lead-Free (GPLF) Reliability Characterization
HDP User Group Facilitatior - Ruben Bergman, ruben.bergman@hdpug.se
Background: The date for full implementation of lead free assembly in the Electronics Manufacturing Industry is fast approaching, but many questions remain on the reliability and optimization of the process.
Problem: Data must be generated at the extremes of the lead free assembly process to clearly identify the operating margin. Reliability data must be generated on assemblies manufactured at these extremes to understand weaknesses and failure modes of the technology.
Approach: The project team will design a test vehicle, assemble and thermal stress test the vehicle to determine the minimum solder temperature required for reliable SAC solder joints. They will also reduce the peak reflow temperature variation across a board by extending the soak time and total reflow duration time, and evaluate forward and backward compatibility on a range of component styles and plating finishes. A set of process recommendations supported by ATC reliability data will then be generated.
Mild Acceleration Factors
HDP User Group Facilitatior - Laurence Schultz - l.schultz@cmpengineer.com
Since accelerated test conditions may be introducing failure modes, the project will perform a mildly accelerated temperture temperature cycle tests to evaluate this hypothesis. SnPb products otherwise identical are used as the control/baseline.
For more information, go to the Mild Acceleration Factors Project page.
SAC Microvoids
HDP User Group Facilitatior - Jack Fisher, fish5er@mindspring.com
Background: Brittle fractures are often seen in cross sections of failed SAC lead free solder joints after drop and shock testing. Often these failures are seen in conjunction with microvoids in and around the intermetallic layer.
Problem: A thorough understanding of these brittle fracture failures and the influence and cause of microvoids is necessary for an understanding of the reliability of SAC lead free assemblies. This understanding will lead to improvements in the manufacturing process and overall reliability of these assemblies.
Approach: Quantify the effect of copper plating bath parameters and other treatment of the copper plated layer on the formation of microvoids in SAC and SnPb solder joints. The effects of feature edges and feature sizes will also be investigated. Use Hull Cell technique to quickly create many samples with several input variables. Evaluate the plated Hull Cell panels with respect to voids, shock test, resistance, and other output parameters. Prepare a final report for the HDP User Group Members detailing the findings and recommendations of the project.
Members Only Implementation Stage Projects:
