Member News
Member News
Idea Stage
Issues that have been proposed as a meaningful project to HDP User Group and are just beginning are in the Idea Stage. The idea for a project can come from any source, including someone from one of our Member Companies, one of the HDP User Group Staff, or even someone who is not connected to HDP. There are currently more that 50 different topics and issues that are under discussion.
A brief description of the problem and possible approach to a solution is circulated among the membership and discussed, usually at a meeting, to get feedback and a level of interest. If at least 2 or more companies are interested, and the HDP Staff believe that the problem fits within the organizations charter, the issue moves into the Project Definition stage.
The following projects are in the Idea Stage:
-
Packaging for Portable Applications - The shock and vibration requirements of portable applications can put a severe strain on the rliability of materials and components. As a result, more information and better drop tests are needed to properly evaluate the new lead free solders and fine pitch components.
-
PWB Embedded Passives - Being able to create passive components during the Printed Wiring Board (PWB) fabrication process (embedded passives)rather than adding them as descrete components after the PWB is fabricated, offers significant possibilities for cost savings and reliability improvement; However, older technologies for creating embedded passives have not been able to reach the resistance and capacitance values in the board area required by many of todays applications. New technology developments offer the promise of meeting these needs. These new technologies should be evaluated and tested for capability and reliability.
Lead-free Mixed Technologies/Rework
- Lead free solder joints manufactured using a single solder alloy have shown to be reliable in many electronics assembly applications. It may be necessary in some cases, such as rework, to use different solder alloys in the joint, and even lead containing and lead free solders mixed. The effects on reliability and performance of mixing these different alloys is not understood or characterized at this time. An activity should be undertaken to understand the effects of mixing different lead free solders, and in mixing lead free and lead contaning alloys. <\p>
If you would like more information on any of these idea stage projects, contact the HDP Staff.
