The HDP User Group has for several years been studying ways of facilitating the transition to lead-free assembly.

HDP User Group has published a comprehensive reference guide for companies wishing to implement a lead-free board manufacturing process and to help the electronics industry transition to lead-free products and processes. The key focus of the guideline is on establishing an assembly solder system that offers compatibility with various solders initially introduced by early adopters of lead-free manufacturing. In addition it contains several suggestion for addressing manufacturing and process development challenges. This guide, called General Purpose lead-free Assembly (GPLF) Guideline is available from public domain portion of HDP User Group web site at www.hdpug.org, free of charge.

Many companies are concerned about the risk of tin whisker formation when matte tin and other tin rich finishes are used as a component terminal finish. Nickel/Palladium based finishes have no risk of tin whisker formation. There are, however, some misconceptions about properties of this type of surface finish such as assembly quality, reliability and cost. HDP User Group has therefore assembled a report aimed at clarifying these misconceptions. The report covers economic implications, introduces detailed technical properties of package assembly quality such as solderability, MSL (Moisture Sensitivity Level), and shows applications when this finish is used on Alloy 42 leadframes. The report is available from public domain portion of HDP User Group web site at www.hdpug.org, free of charge.

HDP User Group and its member companies continue to evaluate the performance, availability and environmental aspects of lead-free materials as this is an emerging focus area for the industry. Ruben Bergman of HDP User Group said, “HDP User Group and its member companies have long been focused on key environmental issues that impact product design.

About HDP User Group International Inc.

HDP User Group International is an international non-profit organization with a mission to resolve electronic packaging issues of common interest in the interface between users (system integrators and contract assembly manufacturers) and their supply chains. The consortium is made up of more than 25 members, most of them with a global presence. The international headquarters is situated in Scottsdale, AZ, USA and the Asian and European offices in Tokyo and Stockholm respectively.

HDP User Group focuses on issues such as reliability characterization of new packaging concepts, activities aimed at support members becoming compliant with market and legislative environmental requirements as well as optical packaging activities. Eliminating barriers to lead-free electronics and broader Design for Environment aspects have been a major focus over the last few years.

For more information, visit HDP User Group on the Internet at www.hdpug.org or contact Ruben Bergman at ruben.bergman@hdpug.se phone number +46 8 869868.