"Technology Development in Today's Global Environment"

Polymer Ball Test Vehicle

Large Ceramic Polymer Balled grid array TV used for reliability assessment.


“Global Collaboration” Over 120 Asian participants attend HDP quarterly meeting.


“SAC Aging II project – Photo micro-graphs of array package devices on reliability test vehicle after aging.”


"2014 Progress Report" News Releases, technical articles, and documents can be accessed.

Six Projects Completed with Excellent Benefits to HDP Membership

 All the hard work our members have done recently is paying off in results. Project results that can be used by member companies to improve reliability, reduce cost, improve designs and help with making important technology decisions.

The consortium recently completed six projects which included: Copper Erosion which was testing on various Pb-Free solder alloys and the dissolution of Copper on circuit boards during assembly; High Frequency Measurements which won a best paper at APEX; SAC aging 2 which studied long term reliability of new Pb-Free alloys; Package Warpage 1 which looked at warpage during reflow of large array packages; Anti-Counterfeit 2 which established a compendium of anti-counterfeit methods; Process Sensitive Components which provided a guideline to use of temperature and chemical sensitive components; and Thin Copper Stress testing which looked at thin plated copper properties.

One of the highlights was the work done by the High Frequency Measurement team. The team of member companies was headed up by Karl Sauter of Oracle and Jack Fisher of HDP who was the project facilitator. The High Frequency Test project centered on evaluating several methods for testing high frequency PWB materials for various properties, which are key to high-speed circuit design. Today there are many ways to test and no relative comparison of the methods. Furthermore, there is no definition of moisture for any of the existing tests and moisture can significantly impact the test results. In this project OEMs and Material Suppliers worked closely in characterizing these methods as well as the impact of moisture. The paper the team presented at IPC APEX EXPO won the prestigious honor of best paper, which is given to one paper each year, selected from all of the papers presented at the symposium.

Results of all projects can be viewed by members at the individual project pages.


With the new website members will have enhanced ways to participate and interact. As an intranet, opportunities for secure collaboration are greatly enhanced and members will have a variety of tools to help them in their project work.

In order to access the member only portion of the web site you must be registered. If your company is a member of HDP User group, please go the registration link for instructions.


Projects are the lifeblood of an organization like HDP User Group, and they are the main reason why companies choose to join. The knowledge and experience gained through interaction with other team members during the execution of the project, and the results generated by our projects are our major deliverables.

HDP is a project oriented consortium dedicated to improving cooperation of all levels of the electronic packaging supply chain including system integrators, contract assembly manufacturers, and suppliers. Collaborative projects are run in a domain where members can gain much more by joint activities rather than duplicating work in each member company.  Members share resources and are supplemented by a small project facilitation staff. 

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