Latest Project Activity

May 06, 2019

VeCS Technology Evaluation

The High Density Packaging User Group is starting a project to evaluate Vertical Conductive Structures – VeCS.  VeCS is a relatively new patented technology by NextGIn Technology for creating a…

Member Meetings

May 22 - May 23

HDP Asia Member Meeting

hosted by TTM

Most Recent News

April 26, 2017

HDP User Group Announces New Project

The initiation of a new project that is open for industry participation, CAF TV for Material Characterization. “Conductive Anodic Filamentation (CAF) manifests as an abrupt unpredictable loss of insulation resistance in electronic circuits during use. This project will focus on material screening to assess susceptibility before the material is used to build product” said Alun Morgan project facilitator.