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Latest Project Activity
July 02, 2019
VeCS Technology Evaluation
The High Density Packaging User Group is starting a project to evaluate Vertical Conductive Structures – VeCS. VeCS is a relatively new patented technology by NextGIn Technology for creating a…
October 9 @ 9:00 am - October 10 @ 6:00 pm
HDP October 9–10, 2019 Member Meeting
Request an Invitation
Most Recent News
April 2, 2019
HDP User Group Announces Firan Technology Group as a New Member
High Density Packaging (HDP) User Group is pleased to announce that Firan Technology Group Corporation (FTG) has become a member. “FTG has consistently looked to understand
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