"Technology Development in Today's Global Environment"

Polymer Ball Test Vehicle

Large Ceramic Polymer Balled grid array TV used for reliability assessment.

Meetings

HDP User group holds its first meeting of 2015 at the Hitachi Research Center at the University of California – Irvine

Projects

“SAC Aging II project – Photo micro-graphs of array package devices on reliability test vehicle after aging.”

Information

"2014 Progress Report" News Releases, technical articles, and documents can be accessed.

Our Next Member Meeting - Sept 9 & 10


It’s time to meet with project team members face to face and get the latest project information and results on HDP programs that are important to your company. The next member meeting will be held in Atlanta and will be hosted by Engent. The meeting will include a tour of the Engent facility. For registration and hotel information please contact Kim Andrews.  The meeting registration deadline is August 28th and the hotel deadline is August 27.

Keep reading.

Members

In order to access the member only portion of the web site you must be registered. If your company is a member of HDP User group, please go the registration link for instructions.

As a registered member you will have access to all projects that are in implementation phase as well as data and reports from past projects.

If your company is not a member and you would like to learn more about our project portfolio and the benefits of membership. Please contact our Marketing Director, Larry Marcanti.

Projects

HDP is a project oriented consortium dedicated to improving cooperation of all levels of the electronic packaging supply chain including system integrators, contract assembly manufacturers, and suppliers. Collaborative projects are run in a domain where members can gain much more by joint activities rather than duplicating work in each member company. Members share resources and are supplemented by a small project facilitation staff.

“The mission of HDP User Group International Inc. is to reduce the costs and risks for the electronics industries when employing the use of electronic packaging.”

 

Upcoming Events