Latest Project Activity

July 02, 2019

VeCS Technology Evaluation

The High Density Packaging User Group is starting a project to evaluate Vertical Conductive Structures – VeCS.  VeCS is a relatively new patented technology by NextGIn Technology for creating a…

Member Meetings

October 9 @ 9:00 am - October 10 @ 6:00 pm

HDP October 9–10, 2019 Member Meeting

hosted by DELL

Most Recent News

April 2, 2019

HDP User Group Announces Firan Technology Group as a New Member

High Density Packaging (HDP) User Group is pleased to announce that Firan Technology Group Corporation (FTG) has become a member. “FTG has consistently looked to understand […]